1.Waste Chip Collection
Collect waste BGA chips that need residual solder removal and arrange them neatly for unified processing.
2. Heating Used Chips
Place chips on the heating platform and heat evenly to melt the solder balls on the chip bottom.
3. Residual Solder Removal
Wipe away molten solder on chip pads with high-temperature sponge to remove all excess tin.
4. Clean Chip Surface
Fully clear leftover solder to obtain flat, clean pads for subsequent reballing work.
