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LW-06 Hot selling touch screen 3heating zone BGA rework station
LW-06 Hot selling touch screen 3heating zone BGA rework station
LW-06 Hot selling touch screen 3heating zone BGA rework station
LW-06 Hot selling touch screen 3heating zone BGA rework station
LW-06 Hot selling touch screen 3heating zone BGA rework station
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LW-06 Hot selling touch screen 3heating zone BGA rework station

LW-06 Rework Workbench Intelligent touch screen three-temperature BGA desoldering station SMT chip parts desoldering rework

Quality Assured
Factory Control
Fast Delivery
Global Shipping
4+
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500+
Orders
98%
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Product Information

Professional specifications and comprehensive information

1. Utilizes linear slides for precise fine-tuning or rapid positioning of the X, Y, and Z axes, offering high positioning accuracy and quick operation.

2. Features a touchscreen human-machine interface and microcontroller control, capable of storing multiple sets of user temperature curve data. Includes power-on password protection and modification functions. During operation, temperature data is displayed on the touchscreen as a curve, with instant curve analysis capabilities.

3. Employs three independent heating zones: upper and lower zones use hot air heating, and the bottom zone uses infrared heating. Temperature is precisely controlled within ±3 degrees Celsius. The upper zone can be freely moved as needed, the second zone is vertically adjustable, and the upper and lower heaters can be set with multiple temperature control segments simultaneously. The IR preheating zone’s output power can be adjusted according to actual requirements.

4. The hot air nozzle can rotate 360°. The bottom infrared heater ensures even heating of the PCB board.

5. Uses high-precision K-type thermocouple closed-loop control, with an external temperature measurement interface for precise temperature detection. PCB board positioning uses a V-shaped groove, and flexible and convenient movable universal fixtures protect the PCB board, preventing damage to components on the PCB edges and PCB deformation, and accommodating various BGA package sizes for rework.

6. Uses a high-power cross-flow fan to quickly cool the PCB board, improving work efficiency. Includes a built-in vacuum pump and external vacuum suction pen for convenient and quick removal of BGA chips.

7. Features an alarm function upon completion of the soldering work, and includes an “early warning” function for user convenience.

8. This machine is CE certified and equipped with an emergency stop switch and automatic power-off protection device in case of abnormal events. In case of temperature runaway, the circuit automatically shuts off, providing double over-temperature protection.

9. Equipped with a laser positioning red dot for quick and easy positioning of the chip to be reworked.

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