6800W LV-09 BGA Rework Soldering Station for Precision Repairs on Laptops, Servers, and Motherboards

Device Core Features
1. Convenient operation: touch screen man-machine interface, heating/cooling time, temperature and other parameters intuitive setting, easy to use;
2. High-quality heating: imported carbon fiber heating wire (fast heating, temperature synchronization, anti-PCB deformation), German Schott microcrystalline glass (1200°C high temperature resistance);
3. Accurate temperature control: Japan’s Panasonic PLC Dalian Institute of Technology temperature control module displays 7 temperature curves and 4 independent temperature measuring ports in real time; Closed-loop control of type K thermocouple imported from the United States, temperature difference of 1 C;
4. Flexible heating: independent temperature control in 3 temperature zones (adjustable temperature/time/heating slope), simulation of reflow soldering in 10 temperature zones to ensure BGA welding effect;
5. Strong automation: automatic feeding/suction/discharge, automatic identification of chip center by alignment, movable lens to prevent dead angle; 4 modes of welding/unloading/mounting/semi-automatic are supported;
6. Accurate alignment: imported optical alignment system 15-inch HD screen, X/Y/R axis high-precision micrometer adjustment (0.01mm accuracy), integrated design of upper heating head and mounting head;
7. Wide adaptability: multi-specification BGA heating air nozzle (easy to change and customizable), suitable for lead-free process and repair of double-layer BGA, QFN, QFP and other devices to avoid human errors