Precision Thermal Control
Defining the Standard for Yield
Addressing common challenges in the rework of 5G communication boards, server motherboards, and precision chips, such as PCB warping and cold solder joints. LWFix employs PLC closed-loop temperature control and micron-level optical alignment technology, achieving a rework success rate exceeding 99%.
LV-10 Automatic System
Flagship Optical Alignment Station
Why do 80% of rework failures stem from equipment?
When handling lead-free soldering, large-sized server motherboards, or fine-pitch chips, traditional equipment often faces three critical flaws
PCB Thermal Warping
Insufficient preheating area at the traditional bottom causes uneven heating of the motherboard, making it highly susceptible to physical bending during desoldering of large boards. This leads to pad detachment or short circuits
Visual Alignment Error
When aligning BGA chips with 0.15mm pitch using manual visual inspection and stencil frames, it is akin to “a blind man feeling an elephant,” making pin misalignment highly likely
Temperature Control Curve Distortion
Substandard temperature control modules fail to accurately simulate reflow soldering curves, resulting in board explosions due to excessive heating rates or cold solder joints caused by insufficient cooling rates
LWFix Product Series
From entry-level manual stations to industrial fully automatic systems, we have the precise tool for your repair needs.
Optical Alignment Series Premium
LV-10 Fully Automatic Rework Station
Industry-leading fully automatic model. Integrates automatic pick-up, alignment, and soldering functions, specifically designed for 5G communication equipment, large-sized server motherboards, and high-density chips
LV-09 High-Power Optical Edition
6800W powerful performance effortlessly handles multi-layer thick PCBs and oversized BGA chips
LV-08 / LV-08s Professional Edition
The most popular optical alignment model, supporting wide PCBs (560mm), stable and reliable with precise temperature control
Standard & Manual Series Standard & Economic
LV-06 Touchscreen Model
Laser red dot positioning, PLC touchscreen operation. The preferred choice for mid-range repair shops and personal studios
- • 4800W / 3 temperature zones
- • PLC curve storage
- • Laser positioning system
LV-05 Compact Edition
Features precision linear guides for smooth movement, three independent heating zones, and stable temperature control
- • Linear guide-driven axes
- • High-precision K-type thermocouple
- • Compact body design
LV-03 Power Edition
The pinnacle of performance in the manual series. Large-area infrared heating at the base prevents PCB deformation during rework
- • 5100W high power
- • 3 independent temperature zones
- • Reinforced chassis structure
LV-02 Economy Edition
Minimalist interface, an economical solution specifically designed for mobile phone and small notebook motherboard repairs
- • Dual-zone rework solution
- • V-groove universal fixture
- • Exceptional return on investment
Technical Specification Matrix
| Model | Type | Total Power | Max PCB Size | Alignment | Key Feature |
|---|---|---|---|---|---|
| LV-10 | Full Auto | N/A (Servo) | 650×610mm | Auto Vision | 7-Axis, Nitrogen, 0.15mm Pitch |
| LV-09 | Optical | 6800W | 590×460mm | HD CCD | Massive Power for Heavy Boards |
| LV-08s | Optical | 5400W | 560×380mm | HD CCD | Extra Wide PCB Support |
| LV-08 | Optical | 5300W | 460×380mm | HD CCD | Micrometer Precision (Bestseller) |
| LV-07 | Optical | 4800W | 460×380mm | HD CCD | Entry-level Optical |
| LV-06 | Touch PLC | 4800W | 470×370mm | Manual | Large Area Manual Rework |
| LV-03 | Manual | 5100W | 370×335mm | Manual | 3-Zone Independent Control |
| LV-02 | Manual | 3900W | 370×335mm | Manual | 2-Zone Economic |
Contact Our Engineers
Need help choosing the right machine? Our BGA experts provide tailored solutions based on your PCB size and chip type.
- +86 138 2520 9905
- Shenzhen, China